The Pico-ITXe platform was launched by VIA in October 2008. The platform is in effect an expansion of the Pico-ITX form factor, with expansion boards that stack together like Lego to bring whatever I/O or extra features a developer needs for a particular project. VIA calls the bumps in the Lego building blocks SUMIT™ technology, which stands for Stackable Unified Module Interconnect Technology. The EPIA-P710-D expansion module that's just been announced is to first to use that technology.
VIA's miniature x86 platforms have been used in car PCs for a long time. What was once a DIY project, and not for the feint-hearted for ripping apart your dash and playing with wires, is now something manufacturers get done by professionals. Embedded computer designers install car PCs in corporate fleet vehicles, taxis, trucks, etc. This new module is designed for these fleet management in-car PCs.
Like a lot of VIA products now, the modular design is attractive for embedded developers since they are then presented with the hardware they need, without what they don't need-and the teent tiny form factor is an obvious boon for in-dash designs. -
Press Release.
