VIA APC 3D Boot Camp: Web Server team

The VIA APC Boot Camp was held over the weekend of the 19th and 20th January. It brought together a bunch of techie and DIY computer enthusiasts, popped them in groups and asked them to design ideas around the new VIA APC Paper computer - the VIA APC board presented in a carboard and aluminium box the size of a paperback. Write-ups about the weekend are just starting to roll in and here's one from "Avenger Mojo" who was posted to the web server team.

"I was assigned to mentor the Web Service team. We go thought the ideation process, about 8 different web services came up. And the team vote for the a karaoke platform for old people at the end. The platform is online service for old people to sing directly with APC without any other needs. The online subscription freemium and premium, professional signer can sell their air time on our platform. We are trying to resolve the problem of old people can't get to each other physically and not able to find people sing with them. We are still looking for graphic and interface designer and software developers, if you are interested please let me know! Total of 4 ideas were created this weekend. BioGuard to use APC to monitor your fish! Arts Presentation control system. Mood lighting control center."

Meanwhile, the weekend also included a "3D printing jam" and look at all the stuff they created:

Boot Camp VIA Style

Forget the early morning starts and gruelling workouts, VIA's boot camp involves the APC board, Android and creative ideas.

In January 2013, registered participants in the VIA boot camp will turn up at VIA's headquarters in Taipei Taiwan for two days of one on one mentoring with experts from VIA on their APC board. Participants will be able to develop and prototype their designs and applications for the APC, even having access to a 3D printer while they're there. A couple of months later, in April 2013, the final results will be showcased at an event, also in Taipei.

The program kicks off at the VIA global headquarters in Xindian, New Taipei City over the weekend of January 19th and 20th, 2013. It will allow participants to form teams to take on the challenge of designing and building connected hardware devices using the APC platform. Industry experts will be on hand to assist and mentor teams as they work through their prototype builds. Participants will also have the opportunity to experiment with 3D printers for conceptualizing and prototyping. 

Event Schedule: The APC Boot Camp will kick off the weekend of January 19th and 20th, 2013, followed by regular progress meet-ups and a final showcase event April 14th, 2013.

To register your spot, visit VIA's APC website.