In January 2013, registered participants in the VIA boot camp will turn up at VIA's headquarters in Taipei Taiwan for two days of one on one mentoring with experts from VIA on their APC board. Participants will be able to develop and prototype their designs and applications for the APC, even having access to a 3D printer while they're there. A couple of months later, in April 2013, the final results will be showcased at an event, also in Taipei.
The program kicks off at the VIA global headquarters in Xindian, New Taipei City over the weekend of January 19th and 20th, 2013. It will allow participants to form teams to take on the challenge of designing and building connected hardware devices using the APC platform. Industry experts will be on hand to assist and mentor teams as they work through their prototype builds. Participants will also have the opportunity to experiment with 3D printers for conceptualizing and prototyping.
Event Schedule: The APC Boot Camp will kick off the weekend of January 19th and 20th, 2013, followed by regular progress meet-ups and a final showcase event April 14th, 2013.
To register your spot, visit VIA's APC website.
